Know About the SiP Package Substrates in Details
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Ceramic substrates, such as alumina (Al2O3) or aluminum nitride (AlN), are favored for SiP packages requiring superior thermal conductivity, high-frequency performance, and reliability. Ceramic substrates exhibit excellent thermal dissipation capabilities, making them ideal for high-power applications and environments with stringent thermal requirements. They also offer superior dimensional stability and reliability compared to organic substrates, albeit at a higher cost.
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High Quality PCB Co., Limited
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