Electroless Nickel Immersion Gold (ENIG)

ENIG is a two-layer metallic covering in hard gold PCB. Nickel is a copper boundary and it is the surface to which the parts are welded. During capacity, the gold safeguards the nickel and gives the low contact obstruction that is required for the meager gold stores. In the PCB business, ENIG is presently the most utilized finish and it is a direct result of the development and execution of the RoHS guideline.

Electroless Nickel Electroless Palladium Drenching Gold (ENEPIG)

ENEPIG which is an overall rookie to the circuit board world previously showed up in the market in the last part of the 90s. Nickel, palladium, and gold give a three-layer metallic covering and it gives you choice like no others and it is very bondable. Because of the incredibly significant expense layer of palladium and low interest of purpose, ENEPIG's originally broken at a printed circuit board surface treatment failed with assembling.

Is it true that you are choosing g the Right Gold Plating Technique?

Appearance

Delicate gold plating/ENIG plating is inclined to get scratched. For the most part, plating in applications that require wonderful gold contacts, (for example, apparent interconnect applications) is prescribed to involve hard gold in Hard Gold PCB.

Contact Power Retention and Wear Opposition

Hard gold plating gives hardness and wears opposition. For applications that require continued sliding wear or on-off exchanging, hard gold plating is exceptionally indicated.

Erosion Opposition/Biocompatibility

Delicate gold plating/ENIG plating gives high immaculateness and is unrivaled in erosion obstruction. Be that as it may, different parts of hard gold plating lessen the general erosion obstruction of the covering and at high temperatures are handily oxidized. So for clinical applications that focus on this, delicate gold plating/ENIG plating is a superior decision.

Contact Opposition

Delicate gold plating has lower contact opposition when contrasted with hard gold plating. It is explicitly for high-temperature applications which are a direct result of the sped-up development of oxides and different mixtures. Hard gold plating increments contact obstruction.

Bond/Solderability

In Hard Gold PCB, the presence of non-valuable metal components makes it more challenging to get welded than delicate gold plating/ENIG plating.

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