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2.5D and 3D ASIC design technologies-2.5D SoC SiP-HBM 3D-stacked-DRAM technology
HBM3/2E/2 IP Subsystem The HBM3/2E/2 IP is suitable for applications involving graphics, high-performance computing, high-end networking, and communications that require very high bandwidth, lower ...
http://linqto.me/iedq
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Idea-to-Silicon-2.5D Packaging Technology-SoCs for High Performance ...
Your fastest path to custom silicon is here When standard products don’t meet your business or technical requirements, it’s time to go custom. Specialized custom SoC solutions can be optimized for ...
http://linqto.me/iedl
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contentone987
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